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The use of high temperature thermoplastics and their structured metallization opens up a new dimension of circuit carrier design to the electronic industry: Molded Interconnect Devices (MID).

On the 29th and 30th September 2010, the 9th International Congress MID 2010 will take place at the congress center of Fuerth. This worldwide leading event about MID technology will present an internationally accepted forum that enables intensive exchange of experiences in the field of molded interconnect devices.

MID are injected molded thermoplastic parts with integrated circuit traces. They provide enormous technical and economic potential and offer a remarkable improved ecological behaviour in comparison to conventional printed circuit boards, they will however not replace but complement.

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