Physical Principle	Process/Material Interaction
	subtractive	additive	mass containing	joining
Mechanical force	Ultrasonic Machining ECF
Melting, vaporization, ablation	EDM ELID Laser Micromachining	CVD PVD	Laser Bending	Bonding
Dissolution	ECM Lithography & Etching
Recomposition		Electroforming Electroplating
LIGA	Combination of dissolution (x-ray lithography), recomposition (electroforming) and mass containing (molding)