Adhesive Bonding is a modern joining process in which a liquid or semi liquid substance is applied to adjoining work pieces to provide a long lasting bond. This process is highly useful in bonding dis-similar materials that can not be welded. Materials that have the ability to be bonded together are virtually unlimited. Adhesives used in bonding can exist in many forms and be made from various natural and/or artificial compounds. A hindrance to this process is that adhesive bonds are not instantaneous such as welding or nailing. Adhesive bonds take more time to process, in order to allow the adhesives to cure.
from the wikipedia article on Adhesive Bonding
Contact:
Fraunhofer IBMT
Fraunhofer-Institute for Biomedical Engineering
Head of Department Biomedical Microsystems
Dr. Thomas Velten
Ensheimer Strasse 48
66386 St. Ingbert
Germany
phone: +49 (0)6894 980-301
thomas.velten@ibmt.fraunhofer.de
IBMT homepage
used materials: various
process parameters:
temperature: roomtemp. - 150 °C
used chemicals: several epoxy adhesives or several conducting adhesives
Contact:
Fraunhofer IBMT
Fraunhofer-Institute for Biomedical Engineering
Head of Department Biomedical Microsystems
Dr. Thomas Velten
Ensheimer Strasse 48
66386 St. Ingbert
Germany
phone: +49 (0)6894 980-301
thomas.velten@ibmt.fraunhofer.de
IBMT homepage
OR:
IMTEK
University Freiburg, Institute of Microsystem Technology, IMTEK
Department for Process Technology
Dr. Andreas Schoth
Georges-Köhler Allee 103
79110 Freiburg
Germany
phone: +497612037355
Andreas.Schoth@imtek.uni-freiburg.de
Anodic bonding is the bonding of two substrates , usually glass and silicon, by an electrical potential. The substrates are placed between two electrodes and at temperatures around 400° C a high potential (around 1 kV) is applied to the substrates. This forces sodium ions in the glass to move away from the bonding surface. Therefore the surface is highly reactive and bonds easily to the other substrate.
Contact:
RAL
Rutherford Appleton Laboratory
CMF
Dr. Andreas Schneider
Building R18 room G55
Chilton, Didcot
Oxfordshire
OX11 0QX
United Kingdom
phone: +44-(0)1235-44-5178
A.Schneider@rl.ac.uk
material properties:
thermal stability up to 400°C
most relevant chemical non-resistance: KOH, HF
optical transparency: no
Contact:
Fraunhofer IBMT
Fraunhofer-Institute for Biomedical Engineering
Head of Department Biomedical Microsystems
Dr. Thomas Velten
Ensheimer Strasse 48
66386 St. Ingbert
Germany
phone: +49 (0)6894 980-301
thomas.velten@ibmt.fraunhofer.de
IBMT homepage
OR:
FEMTO-ST
CNRS-FEMTO-ST
Dpt. LPMO
Dr. Chantal Khan Malek
32 Av. de l' Observatoire
25044 Besancon
France
phone: +33 (0)3 81 85 39 35
chantal.khan-malek@femto-s
OR:
IMTEK
University Freiburg, Institute of Microsystem Technology, IMTEK
Department for Process Technology
Dr. Andreas Schoth
Georges-Köhler Allee 103
79110 Freiburg
Germany
phone: +497612037355
Andreas.Schoth@imtek.uni-freiburg.de
OR:
RAL
Rutherford Appleton Laboratory
CMF
Dr. Andreas Schneider
Building R18 room G55
Chilton, Didcot
Oxfordshire
OX11 0QX
United Kingdom
phone: +44-(0)1235-44-5178
A.Schneider@rl.ac.uk
material properties:
thermal stability up to 400°C
most relevant chemical non-resistance: KOH
optical transparency: no
Contact:
IMTEK
University Freiburg, Institute of Microsystem Technology, IMTEK
Department for Process Technology
Dr. Andreas Schoth
Georges-Köhler Allee 103
79110 Freiburg
Germany
phone: +497612037355
Andreas.Schoth@imtek.uni-freiburg.de
OR:
RAL
Rutherford Appleton Laboratory
CMF
Dr. Andreas Schneider
Building R18 room G55
Chilton, Didcot
Oxfordshire
OX11 0QX
United Kingdom
phone: +44-(0)1235-44-5178
A.Schneider@rl.ac.uk
The substrates are first exposed to a chemical treatment, for example with a mixture of hydrogen peroxide and sulphuric acid. This makes them hydrophilic what is essential for the bonding. By a high contact force, two substrates (e.g two silicon wafers) are compressed. The materials get so close, that molecular adhesive forces begin to act. The material then is annealed at high temperature so that the direct bonding is strong enough to keep the substrates together.
Contact:
RAL
Rutherford Appleton Laboratory
CMF
Dr. Andreas Schneider
Building R18 room G55
Chilton, Didcot
Oxfordshire
OX11 0QX
United Kingdom
phone: +44-(0)1235-44-5178
A.Schneider@rl.ac.uk
material properties:
thermal stability up to 400 °C
most relevant chemical non-resistance: KOH, HF
optical transparency: no
process parameters:
temperature: room temperature
notes: fusion bonding
Contact:
RAL
Rutherford Appleton Laboratory
CMF
Dr. Andreas Schneider
Building R18 room G55
Chilton, Didcot
Oxfordshire
OX11 0QX
United Kingdom
phone: +44-(0)1235-44-5178
A.Schneider@rl.ac.uk
Contact:
IMTEK
University Freiburg, Institute of Microsystem Technology, IMTEK
Department for Process Technology
Dr. Andreas Schoth
Georges-Köhler Allee 103
79110 Freiburg
Germany
phone: +497612037355
Andreas.Schoth@imtek.uni-freiburg.de
For plasma bonding, plasma activation has to be done first with the intent to alter or improve adhesion properties of surfaces prior to coating, etc. Weakly ionised oxygen plasma is used and several processes take place. Plasma removes surface layers with the lowest molecular weight, at the same time it oxidises the uppermost atomic layer of the polymer. Oxygen radicals (and UV radiation, if present) help break up bonds and promote the three dimensional cross bonding of molecules. Oxidation of the polymer is responsible for the increase in polar groups which is directly related to the adhesion properties of the polymer surface. After having exposed the substrates to the oxygen plasma they are pressed together and then heated to a temperature slightly below the glass transition temperature. This establishes a durable bond between the two substrates.
Contact:
Fraunhofer IBMT
Fraunhofer-Institute for Biomedical Engineering
Head of Department Biomedical Microsystems
Dr. Thomas Velten
Ensheimer Strasse 48
66386 St. Ingbert
Germany
phone: +49 (0)6894 980-301
thomas.velten@ibmt.fraunhofer.de
IBMT homepage
process parameters:
temperature: room temperature
used chemicals: oxygen plasma
Contact:
Fraunhofer IBMT
Fraunhofer-Institute for Biomedical Engineering
Head of Department Biomedical Microsystems
Dr. Thomas Velten
Ensheimer Strasse 48
66386 St. Ingbert
Germany
phone: +49 (0)6894 980-301
thomas.velten@ibmt.fraunhofer.de
IBMT homepage
process parameters:
temperature: room temperature
used chemicals: oxygen plasma
Contact:
Fraunhofer IBMT
Fraunhofer-Institute for Biomedical Engineering
Head of Department Biomedical Microsystems
Dr. Thomas Velten
Ensheimer Strasse 48
66386 St. Ingbert
Germany
phone: +49 (0)6894 980-301
thomas.velten@ibmt.fraunhofer.de
IBMT homepage
OR:
FEMTO-ST
CNRS-FEMTO-ST
Dpt. LPMO
Dr. Chantal Khan Malek
32 Av. de l' Observatoire
25044 Besancon
France
phone: +33 (0)3 81 85 39 35
chantal.khan-malek@femto-st.fr
In roll laminating, two polymer foils are bonded. Usually one of them is structured and the other one just serves to seal the microchannels. Roll laminating is a continuous process and therefore suitable for mass production. The rolls of foil are unwound during the process and pressed together. High temperature and pressure are usually necessary but variable. Optionally, chemical agents may be added. As a result the foils are bonded and the single structures can be cut out.
Contact:
Fraunhofer IBMT
Fraunhofer-Institute for Biomedical Engineering
Head of Department Biomedical Microsystems
Dr. Thomas Velten
Ensheimer Strasse 48
66386 St. Ingbert
Germany
phone: +49 (0)6894 980-301
thomas.velten@ibmt.fraunhofer.de
IBMT homepage
material properties:
thermal stability up to about 140°C
most relevant chemical non-resistance: acetone
optical transparency: yes
process parameters:
temperature: about 100°C
used chemicals: confidential
Contact:
Fraunhofer IBMT
Fraunhofer-Institute for Biomedical Engineering
Head of Department Biomedical Microsystems
Dr. Thomas Velten
Ensheimer Strasse 48
66386 St. Ingbert
Germany
phone: +49 (0)6894 980-301
thomas.velten@ibmt.fraunhofer.de
IBMT homepage
Contact:
FEMTO-ST
CNRS-FEMTO-ST
Dpt. LPMO
Dr. Chantal Khan Malek
32 Av. de l' Observatoire
25044 Besancon
France
phone: +33 (0)3 81 85 39 35
chantal.khan-malek@femto-st.fr
Thermal bonding exploits the fact that thermoplastic polymers become soft at elevated temperatures close to the glass transition temperature. Therefore the substrates to be bonded are heated and then pressed together. As the polymer is soft, bindings between the two layers establish and make sure that the bonding lasts after cooling down the substrate. Care must be taken to choose the right temperature to bond the substrate without damaging the microstructure.
Contact:
FEMTO-ST
CNRS-FEMTO-ST
Dpt. LPMO
Dr. Chantal Khan Malek
32 Av. de l' Observatoire
25044 Besancon
France
phone: +33 (0)3 81 85 39 35
chantal.khan-malek@femto-st.fr
used material: Polymethylmethacrylate (PMMA)
material properties:
optical transparency: yes
process parameters:
temperature: around 90 - 110 °C
Contact:
FEMTO-ST
CNRS-FEMTO-ST
Dpt. LPMO
Dr. Chantal Khan Malek
32 Av. de l' Observatoire
25044 Besancon
France
phone: +33 (0)3 81 85 39 35
chantal.khan-malek@femto-st.fr
Wire bonding is the primary method of making interconnections between a microchip, such as an integrated circuit, and a printed circuit board. Wire bonding can also be used to connect an integrated circuit to other electronics or to connect from one printed circuit board to another. Wire diameters start at 15 µm and can be up to several hundred micrometres for high-powered applications. There are two main classes of wire bonding:In either type of wire bonding, the wire is attached at both ends using some combination of heat, pressure, and ultrasonic energy to make a weld.
- Ball bonding
- Wedge bonding
from the wikipedia article on wire bonding
Contact:
Fraunhofer IBMT
Fraunhofer-Institute for Biomedical Engineering
Head of Department Biomedical Microsystems
Dr. Thomas Velten
Ensheimer Strasse 48
66386 St. Ingbert
Germany
phone: +49 (0)6894 980-301
thomas.velten@ibmt.fraunhofer.de
IBMT homepage
material properties:
thermal stability up to 150 °C
process parameters:
temperature: 100 - 150 °C
notes: wedge-wedge bonding
Contact:
Fraunhofer IBMT
Fraunhofer-Institute for Biomedical Engineering
Head of Department Biomedical Microsystems
Dr. Thomas Velten
Ensheimer Strasse 48
66386 St. Ingbert
Germany
phone: +49 (0)6894 980-301
thomas.velten@ibmt.fraunhofer.de
IBMT homepage
OR:
University Freiburg, Institute of Microsystem Technology, IMTEK
Department for Process Technology
Dr. Andreas Schoth
Georges-Köhler Allee 103
79110 Freiburg
Germany
phone: +497612037355
Andreas.Schoth@imtek.uni-freiburg.de
material properties:
thermal stability up to 150 °C
process parameters:
temperature: < 50 °C
Contact:
Fraunhofer IBMT
Fraunhofer-Institute for Biomedical Engineering
Head of Department Biomedical Microsystems
Dr. Thomas Velten
Ensheimer Strasse 48
66386 St. Ingbert
Germany
phone: +49 (0)6894 980-301
thomas.velten@ibmt.fraunhofer.de
IBMT homepage
OR:
University Freiburg, Institute of Microsystem Technology, IMTEK
Department for Process Technology
Dr. Andreas Schoth
Georges-Köhler Allee 103
79110 Freiburg
Germany
phone: +497612037355
Andreas.Schoth@imtek.uni-freiburg.de
material properties:
thermal stability up to 150 °C
process parameters:
temperature: 100 - 150 °C
Contact:
Fraunhofer IBMT
Fraunhofer-Institute for Biomedical Engineering
Head of Department Biomedical Microsystems
Dr. Thomas Velten
Ensheimer Strasse 48
66386 St. Ingbert
Germany
phone: +49 (0)6894 980-301
thomas.velten@ibmt.fraunhofer.de
IBMT homepage
OR:
University Freiburg, Institute of Microsystem Technology, IMTEK
Department for Process Technology
Dr. Andreas Schoth
Georges-Köhler Allee 103
79110 Freiburg
Germany
phone: +497612037355
Andreas.Schoth@imtek.uni-freiburg.de